Get Adhesives Technology for Electronic Applications: Materials, PDF

By James J. Licari,Dale W. Swanson

ISBN-10: 0815515138

ISBN-13: 9780815515135

This ebook is exclusive in its accomplished insurance of all elements of adhesive know-how for microelectronic units and packaging, from conception to bonding to check strategies. as well as basic purposes, akin to dies, substrate, and lid and chip stack attachments, the ebook comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing tools equivalent to UV, microwave, and moisture (which conform to present environmental and effort requisites) are coated. Over eighty tables and a hundred and twenty figures supply a wealth of knowledge on houses, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. every one bankruptcy offers entire references.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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